Izdelki za stroji za rezanje (35)

- Thickness: up to 600 µm - Holes up to 20-50 µm diameter possible (depending on the thickness of the material) - Wall thickness <200 µm - Substrate size: up to 140 x 140 mm² possible (larger parts on request) - Cutting speed depending on material thickness and layout: from 10mm/s Complex structures possible.

Hohe elektrische Durchschlagsfestigkeit, Alterungsbeständigkeit gegenüber optischer Strahlung machen Keramik zum geeigneten Werkstoff in der Lasertechnik.

CowStar ist ihre Trainingsmaschine für Cutting- & Cowhorse-Reiter sowie für Reiter der Disziplin working equitation. Es ist ein robustes Gerät mit 100 meter Seil, einer schwarz-weißen Flagge sowie einer Fernbedienung, über welche Sie die Geschwindigkeit und Richtung der Flagge ändern können. Stromanschluss für 230 V (AC) oder 12-24 V (DC). Eine sanfte Start / Stopp Funktion (3 Stufen wählbar) und eine weltweit zulässige Funkfrequenz machen dieses Produkt zum technischen Spitzenreiter. Zwei Geschwindigkeiten sind stufenlos einstellbar und mit der Fernbedienung zu steuern. Eigenschaften: o weltweit zulässige Funkfrequenz o Spritzwassergeschützt und Staubsicher o zuverlässige und beständige Materialen o geräuscharmer Betrieb o Stromanschluß: 230V (AC) und 12-24V (DC) o Mobiler Betrieb per komfortabler Hand-Funkfernbedienung o Manueller Betrieb per Schalter am Schaltkasten (Antriebseinheit) möglich o 2 Geschwindigkeiten stufenlos regelbar

CNC Drehbearbeitung bis Ø 320 mm und 800 mm Länge konventionelle Drehbearbeitung CNC Fräsbearbeitung mit 3 ( opt. 4 ) Achsen - X=1300 mm konventionelle Fräsbearbeitung mit Universal-Fräsmaschinen CNC Flachschleifen X=1000, Y=400, Z=400 mm Radial- und Horizontalbohrwerke mechanische Bearbeitung von Schweißbaugruppen Baugruppenmontage

Scharmann has developed the ECOSPEED F for highspeed machining of mediumsized aluminium structural components. The horizontal spindle arrangement, the vertical pallet arrangement and the Sprint Z3 parallel kinematic machining head, which delivers high travel speeds (50 m/min) and accelerations (9.81 m/s²), all come from the successful ECOSPEED. What sets the F version apart from the standard ECOSPEED is that the machine column is stationary. The pallet travels in the X direction on the vertically arranged table group. The ECOSPEED F is equipped with a rotating double pallet station, located parallel to the Xaxis, which enables component loading and unloading during the machining cycle Length (X-axis):mm 3,500 Width (Y-axis):mm 2,000 Payload:kg 3,000 X-axis:mm 3,800 Y-axis:mm 2,500 Z-axis (spindle horizontal pos.):mm 670 Z-axis (spindle +/- 45°):mm 370 A/B-axis, conical work envelope:° A/B-axis, conical work envelope Bt-axis (table):sec 184 Pallet changing time (definend cycle):sec 13 Chip to chip time (definend cycle):m/s2 9.81 Acceleration / deceleration in X-axis:m/s2 9.81 Acceleration / deceleration in Y-axis:m/s2 9.81 Acceleration / deceleration in Z-axis:°/s2 685 Acceleration / deceleration in A- and B-axis:m/min max. 50 Rapid traverse / feed in X-axis:m/min max. 50 Rapid traverse / feed in Y-axis:m/min max. 50 Rapid traverse / feed in Z-axis:m/min max. 50 Rapid traverse / feed in Bt-axis:rpm 20 Tool magazine:WERO rack type 129 / 300 pockets C-axis:° 360 continuous

Geeignet zum Schweißen, Schneiden, Wärmen, Flammlöten und Flammrichten in kleinen Arbeitsbereichen. Bestehend aus 1 Griffstück, 4 Schweißeinsätzen, 1 Schneideinsatz mit Hebelventil, 1 Mehrfachschlüssel, 1 Düsenreinigungsgerät, 1 Düsenbehälter, 1 Stahlblechkasten Technische Daten Brenngas: Acetylen Schlauchanschlüsse nach DIN EN 560: für Sauerstoff G 1/4, für Brenngas G 3/8 LH

Mit unserern modernen CNC-Portalfräsen sind wir in der Lage, schnell und kostengünstig Holzteile für Sie herzustellen. Vorteile der CNC-Technik Fertigung komplexer Werkstücke, die sonst nur zeitaufwändig oder gar nicht herzustellen wären eine Serienfertigung von (Spezial-)Holzteilen ist ohne Probleme möglich Konstant genaue Maßeinhaltung bei der Herstellung Schnellere Werkzeugführung als bei der manuellen Herstellung durch einen Maschinenbediener Mehrere Arbeitsschritte sind mit einer Aufspannung möglich. So entfällt das aufwändige Umspannen von Werkstücken. Ein CNC-Programm kann leicht abgeändert werden, um andere Varianten des Werkstücks zu fertigen. Das kann auch notwendig sein, wenn Änderungen an der Konstruktion gewünscht werden.

With the SGC500 portable shielding gas chamber, coaxworks offers a separate machinery component for CNC and robot-based laser wire welding processes. By means of a flexible foil tent and an additional adapter on the laser welding head, a high-purity shielding gas atmosphere can be set up. Bottom connections for a continuous flow of inert argon gas allow a stable oxygen content of less than 20 ppm after only 20 minutes. The SGC500 protective gas chamber has the following integrated technical features: > a handling flap on the front side for quick chamber loading when the foil tent is installed, > two glove ports at the front for component handling when the chamber is flooded, > a removable T-slot plate for defined clamping of components, > three viewing windows for process observation from the outside and > a quick-clamping system on the top for defined fastening of the foil tent. Special designs can be customised. Send us your specific request by e-mail! Dimensions:610 x 610 x 269 mm³ (height x width x depth, without foil tent and gloves) Suitable processible component size:~150 x 150 x 150 mm³ (height x width x depth) Weight:~25kg (without foil tent and gloves) Protective gas connections:4x Ø8 mm hose connection Glove connections:2x Ø144 mm Possible connections for other media:12x screw plug G1/4

3DMicromac’s microMIRA™ LLO system provides highly uniform, force free lift off of different layers on wafers at high processing speed. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The laser system can be used for a variety of applications, such as GaN lift off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing. Additional applications include laser annealing and crystallization for surface modification. Force free and extremely fast line beam laser processing No damage due to thermo-mechanical effects Low production costs Elimination of costly and polluting wet chemical processes Integration of adjacent manufacturing steps for higher fab productivity

The advanced microCELL™ MCS laser cutting system has been developed to meet the photovoltaic (PV) market’s demands for boosting module power output and service life by minimizing power losses and providing for an exceptionally high mechanical strength of cut cells. It enables the highest throughputs for cutting cell sizes up to M12/G12 into half cells or shingled cells. The microCELL™ MCS system takes advantage of 3DMicromac’s patented thermal laser separation (TLS) process for cell separation. The ablation free technique guarantees an excellent edge quality. The microCELL™ MCS system offers half and shingled cell cutting for improved module performance. The TLS Technology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significantly higher module power gain and less module power degradation.

The DMP machine solutions are designed for flexible series production of complex metal components using micro laser sintering. The DMP machine series is the perfect solution to achieve superior detail resolution, highest surface quality, unrivalled accuracy, and very high part density. It offers high flexibility, low operating costs and user friendliness. The system includes a zero point clamping system for easy post-processing at the highest accuracy level and inert gas atmosphere including gas purifying based on industry standards. The DMP systems are able to process non-reactive and reactive materials, e.g. stainless steel, molybdenum, tungsten, titanium, and gold. The Micro Laser Sintering technology has been developed and is continuously improved by 3D MicroPrint GmbH. Superior detail resolution Highest surface quality Unrivalled accuracy Very high part density Build volume (L x W x H):60mm x 60mm x 30 mm Build rate:330 mm3/h (typical) Layer thickness:≤ 5 µm Lateral resolution:down to 30 µm Surface Roughness:down to 2 µm (Ra) Laser source:Fiber laser 50 W (optionally 200 W) Precision optics:High speed galvo scanner Spot diameter:< 30 µm

Neben der Bearbeitung von starren und flexiblen Materialien auf starren Trägersubstraten bieten wir die Bearbeitung von flexiblen Materialien im Sheet-zu-Sheet oder im Rolle-zu-Rolle-Verfahren an. - Lasermikrostrukturierung und -Ablation - Laserbearbeitung „On-the-Fly“ oder „Step and Repeat“ - Rollenbreiten bis zu 300 mm möglich

- Formate von 1/2 bis 1/6-Zellen und Größen bis zu M12 - Freiformschneiden - Leistungssteigerung von bis zu 2W durch TLS-Technologie Die patentierte Lasertechnologie von 3D-Micromac zum direkten Schneiden von Solarzellen ist die führende Methode zum Schneiden von Zellen. Wenn herkömmliche Schneidverfahren an ihre Grenzen stoßen, kommt die TLS-Technologie mit ultrakurzen Pulsen ins Spiel. Exzellente Schnittqualitäten mit hoher Reproduzierbarkeit und Genauigkeit können garantiert werden. Egal ob Halbzelle, Drittelzelle, Viertelzelle oder die zukunftsweisende Sechszelle. Durch die große Flexibilität der TLS-Technologie ist es möglich, unsere Kunden umfassend zu unterstützen. Anpassung in der Anzahl der Zellschnitte, Variation in der Größe der Substrate bis zu 220mm oder eine hohe Flexibilität in der Formfreiheit. Von siliziumbasierten Zelltypen wie PERC, TOPCon, HJT bis IBC ist die Bearbeitung Ihrer mono- und polychristalinischen Photovoltaikzellen möglich.

- Formats from 1/2 to 1/6 cells and sizes up to M12 - Free-form cutting - Power increase of up to 2W through TLS technology 3D-Micromac's patented laser technology for direct cutting of solar cells is the leading method for cutting cells. When conventional cutting methods reach their limits, TLS technology with ultra-short pulses comes into play. Excellent cutting qualities with high reproducibility and accuracy can be guaranteed. Whether half-cell, third-cell, quarter-cell or the trend-setting six-cell. The great flexibility of TLS technology makes it possible to provide our customers with comprehensive support. Adaptation in the number of cell cuts, variation in the size of the substrates up to 220mm or a high flexibility in the freedom of shape. From silicon-based cell types such as PERC, TOPCon, HJT to IBC, the processing of your mono- and polychristaline photovoltaic cells is possible.

The microPREP™ PRO system was developed to provide efficient laser sample preparation fitted to the needs of microstructure diagnostics and failure diagnostics. Therefore, with microPREP™ PRO material samples can be prepared effectively and economically by using an ultrashort pulse laser. microPREP™ PRO allows to create complex and 3D-shaped samples to enable more comprehensive analysis of certain structures like in advanced packages, such as through silicon vias (TSVs), or even complete systemsinpackage (SiP). Furthermore, it is ideal to provide larger sized samples with microlevel precision. The integrated overview camera assists in navigating on larger samples – the high definition process camera allows for exact positioning. Moreover, the application of a picosecond laser ensures virtually no structural damage and no elemental contamination of the material.

The production of ophthalmic lenses requires different marking processes, e.g. technical engraving and branding for spectacle lenses as well as UDI marking for contact lenses. 3DMicromac offers ophthalmic marking solutions for laser engraving of all types of ophthalmic lenses, e.g. prescription and sunglasses, or contact lenses. All systems use UV lasers for permanent marking and guarantee Highest engraving precision Accurate contrast adjustment Reliable process stability Maximum throughput Top availability Flexibility in system configuration and Simple retrofitting. 3DMicromac‘s customers can choose between premium quality excimer laser systems and high quality maintenance free DPSS laser systems. Both are suitable for the production of technical engravings and visible branding on blocked and unblocked lenses, as well as contact lenses. The microMARK™ MCF excimer laser system generates the engravings by cold laser ablation of 193 nm UV radiation.

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

3DMicromac‘s laser system microMARK™ RXe has revolutionized the efficiency of blocked lens engraving by using excimer lasers. Equipped with an optimized optical components setup and a large sized magnification ratio, this new generation of RX marking devices offers an increased depth of focus at lowest laser power operation on all materials. Customers benefit from low investment and small operating costs. High quality engraving Accurate contrast adjustment Low investment and operating costs Reliable process stability Smallest excimer system footprint available on the market High quality engraving with accurate contrast adjustment on a variety of spectacle lenses and coatings Smallest required space on the market Low investment and operating costs Easy retrofit of automated handling system at customer’s site on request

3DMicromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full scale manufacturing of crystalline half cells. The microCELL™ TLS system offers half cell and stripe cutting for improved module performance. The TLSTechnology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significant higher module power gain and less module power degradation.

3DMicromac’s brand new microCETI™ uses the most innovative LIFT (Laser Induced Forward Transfer) laser process, which is an essential factor in the process chain for manufacturing microLED displays. The fully integrated laser system is characterised by its compact footprint and high variability. The microCETI™ enables the transfer of hundreds of millions of microLEDs without the use of mechanical forces, thereby ensuring that microLEDs of almost any shape and size can be transferred. This ensures cost-effective production of microLED displays. Most cost-effective production of microLED displays Unique LIFT module Highest transfer rate ten times faster than competing technologies Flexible software for integration into production lines Handling options for wafers (up to 8″) and sheets (up to Gen.2)

Anwendungen: - Laserschneiden, Dicing und Filamentieren - Laserbohren sowohl im Trepanier- als auch Perkussionverfahren - Lasermikrostrukturierung und -Ablation, z.B. mittels FSLA - Laser-Mikrogravur sowohl an der Substratoberfläche aber auch als Innengravur in transparenten Materialien - Laser-Lift-Off mittels DPSS Laser und Scannersystemen Materialien: Keramiken, Metalle, Polymere, Glaswerkstoffe, Halbleiter, Verbundmaterialien

The microVEGA™ xMR system provides high throughput laser annealing for monolithic magnetic sensor formation. A highly flexible tool configuration, the microVEGA™ xMR can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension—making it an ideal solution for magnetic sensor production. The microVEGA™ xMR uses on-the-fly spot and variable laser energy to provide selective heating of the pinning layer in each sensor in order to “imprint” the intended magnetic orientation. Magnetic field strength and orientation is adjustable by recipe, while high temperature gradients ensure low thermal impact. This allows sensors to be processed directly next to readout electronics as well as closer together, and enables the production of smaller sensors—freeing up space for processing more devices per wafer.

3DMicromac‘s highly versatile microFLEX™ product family is the all-in-one solution for manufacturing flexible thin films in photovoltaics, electronics, medical devices, displays, and semiconductors. The production systems can handle various substrates, material thicknesses, and types such as polymer films, stainless steel, and thin glass. The microFLEX™ systems combine high precision laser processing with cleaning and packaging technologies, as well as inline quality control. Due to its modular concept, various customized solutions are available, reaching from industrial mass production to pilot lines as well as applied research. High throughput and efficiency on-the-fly processing; high machine uptime; multiple tension controllers; contactless substrate guiding Highest flexibility easy machine layout modification by modular concept Cost advantages Long term security of investment; reasonable cost of ownership; easy to upgrade and modify; different micro environments.

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.

3DMicromac‘s microCELL™ OTF meets cell manufacturers‘ demands for increasing the efficiency of PERC solar cells, by precise surface structuring, low operating costs and highest availability. The system is suitable to process mono and polycrystalline silicon solar cells. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects or microcracks. On-the-fly laser processing with unbeatable cost benefit ratio Contactless wafer handling High throughput and efficiency (> 3.800 wph) Low cost of ownership and CAPEX Upgrade for existing production lines or expansion

Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials

Anwendungen: - Excimer Laser-Lift-Off mittels Line-Beam-Systemen - Laserbohren und Ablation mittels Scannersystemen oder Maskenprojektion - Lasergravur von optischen Materialien Materialien: Polymere, Polymerschichtsysteme, Glaswerkstoffe

3DMicromac‘s microMARK™ MCL is a compact and maintenance free DPSS laser system to meet customer’s demand for high quality laser engraving with significantly decreased cost of ownership. The system is utilized for visible, invisible as well as for technical engravings of all kind of spectacle lenses as well as marking of hard and soft contact lenses. The use of a UV DPSS laser source achieves a high quality marking result comparable to excimer laser engravings. High quality laser engraving Accurate contrast adjustment Low investment and operating costs Maintenance free laser source Plug-and-play replacement of main components directly by the customer High quality engraving with accurate contrast adjustment on a variety of spectacle lenses and coatings

The coaxial laser welding head wireXL is expected to expand our product portfolio to a more powerful version from 2023: >> usable with laser powers up to 10 kW, >> built-in sensors for process-related monitoring, > a deflection sensor to protect against damage in the event of collisions or process errors, > an XYZ adjustment unit for precise adjustment of the laser spot – wire input arrangement, > shielding the built-in cover glasses by means of crossjet against splashes, > the reduction of fume contamination on the cover glasses by an integrated downjet and > the possibility to replace the protective glasses by means of interchangeable slides. Special designs are still possible on customer request. Send us your specific request by e-mail!

3DMicromac‘s microSHAPE™ laser system is designed for the processing of large and flat substrates with high accuracy. The highly versatile system allows the combination of different laser processes in a single machine. In addition, it is capable of processing with multiple working heads – this parallel processing makes higher throughputs achievable. microSHAPE™ is an industry proven solution for all kinds of ablative and non-ablative processes. These include cutting, selective removal of thin films, and structuring processes like engraving and marking. The microSHAPE™ system is suitable for machining a variety of materials, e.g. glass, metals, polymer, ceramics, display stacks, and coated substrates. Free form cutting with extraordinary quality Damage free cutting edges Contactless processing enables minimal cost of ownership Cutting speed up to 1.5 m/sec Laser sources according to customer requirements Up to 3 independent beam paths